Context: The circuit board is assumed to be made of a PCB elastic material with a Young's modulus of 45 × 109 Pa and a Poisson's ratio of 0.3. The mass density of the board is 500 kg/m3. Define a material named The foam packaging material will be modeled using the crushable foam
plasticity model. The elastic properties of the packaging include a Young's
modulus of 3 × 106 Pa and a Poisson's ratio of 0.0. The material
density of the packaging is 100 kg/m3. Define a material named
The yield surface of a crushable foam in the p–q (pressure stress-Mises equivalent stress) plane is illustrated in Figure 1. The initial yield behavior is governed by the ratio of initial yield stress in uniaxial compression to initial yield stress in hydrostatic compression, , and the ratio of yield stress in hydrostatic tension to initial yield stress in hydrostatic compression, . In this problem we have chosen the first data item to be 1.1 and the second data item (which is given as a positive value) to be 0.1. Hardening effects are also included in the material model definition. Table 1 summarizes the yield stress–plastic strain data.
The crushable foam hardening model follows the curve shown in Figure 2. For your convenience, the hardening data are available in a text file named
In the material editor, select
Foam
Hardening. Select the first cell in the suboption editor, and click
mouse button 3. From the menu that appears, select Read from
File. Select the file named
Define a homogeneous shell section named
For the circuit board it is most meaningful to output stress results in the longitudinal and lateral directions, aligned with the edges of the board. Therefore, you need to specify a local material orientation for the circuit board mesh. |