Seed the circuit board with 10 elements along its length and height. Seed the edges of the packaging as shown in Figure 1. ![]() The mesh for the packaging is too coarse near the impacting corner to provide highly accurate results; however, it is adequate for a low-cost preliminary study. Using the swept mesh technique (with the medial axis algorithm), mesh the packaging with C3D8R elements and the board with S4R elements from the Abaqus/Explicit library. Use enhanced hourglass control for the packaging mesh to control hourglassing effects. Specify a global seed of 1.0 for the floor, and mesh it with one Abaqus/Explicit R3D4 element. Note:
The suggested mesh density exceeds the model size limits of the Abaqus Learning Edition. Specify 12 elements along the length of the foam packaging if using this product. Create a job named |